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LD8N12
Features & Benefits:
-High bond strength to surfaces
-Thermal conductive
-Different thickness available
Typical Application Includes:
-DDR RAM assembly
-LED Lighting
Configurations:
-Sheet form/roll form/die-cut parts
Available Thickness:
-0.05,0.1, 0.15, 0.2mm -Max.width:1030mm
|
Properties |
8N12-T05 |
8N12-T10 |
8N12-T15 |
8N12-T20 |
|
Carrier |
NONE |
NONE |
NONE |
NONE |
|
Thickness |
0.05mm |
0.10mm |
0.15mm |
0.20mm |
|
Peel Strength (PSTC-101)(N/25mm) |
>10.78 |
>13.72 |
>13.72 |
>15.68 |
|
Continues Use. Temp. (°C) |
-20 to 120 |
-20 to 120 |
-20 to 120 |
-20 to 120 |
|
Retention （1Kg/Inch/25°C) |
1.1 |
1.4 |
1.4 |
1.4 |
|
Breakdown Voltage(Kv) |
1.57 |
2.22 |
2.55 |
4.29 |
|
Thermal conductivity (ASTM D5470) |
1.2w/m.k |
1.2w/m.k |
1.2w/m.k |
1.2w/m.k |
|
Thermal Resistance (AMD 2240)@40PSI |
0.414C*in2/w |
0.558C*in2/w |
1.07C*in2/w |
1.173C*in2/w |
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Keywords：Thermal Adhesive Tapes Thermal Tapes
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