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Home > LD8F10
LD8F10
Features & Benefits:
-High bond strength to surfaces
-Thermal conductive and electrically isolating
-Excellent wet-out and high thermal performance
Typical Application Includes:
-Where need mount heat sink onto BGA graphic/drive processor -Where need mount heat spreader onto power converter PCB/Motor
-LED Lighting
Configurations:
-Sheet form/roll form/die-cut parts
Available Thickness:
-0.1, 0.15, 0.2, 0.25, 0.3mm -Max.width:1030mm
Properties 8F10-T10 8F10-T15 8F10-T20 8F10-T25 8F10-T30 Reinforced Material Fiberglass Fiberglass Fiberglass Fiberglass Fiberglass Thickness 0.1mm 0.15mm 0.2mm 0.25mm 0.3mm Peel Strength (PSTC-101)(N/25mm) >13.72 >13.72 >13.72 >13.72 >13.72 Continues Use. Temp. (°C) -20 to 120 -20 to 120 -20 to 120 -20 to 120 -20 to 120 Retention （1Kg/Inch/25°C） >48 >48 >48 >48 >48 Adhesion(Kg/Inch) 1.1 1.4 1.4 1.4 1.4 Breakdown Voltage 2 2.5 3.5 4 6 Thermal conductivity (ASTM D5470) 1.0W/M.K 1.0W/M.K 1.0W/M.K 1.0W/M.K 1.0W/M.K
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Keywords：Thermal Adhesive Tapes thermal tapes
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